Endura Technologies and UNISOC Announce Commercial Partnership

Endura Technologies, a power management and smart audio solutions maker, recently announced a commercial partnership with UNISOC (formerly Spreadtrum Communications) to deliver power, performance, and area improvements in the 12nm and 7nm advanced process nodes.

“We are pleased to work with Endura as its innovative and customized solutions enhance the performance of various SoC platforms from UNISOC,” said John Rowland, SVP, UNISOC. “Power management has always been a vital factor to evaluate chipset performance, and we are confident to say that through our cooperation with Endura, progress has been made on increasing the competitiveness of our products on the market.”

Endura and UNISOC have initiated the partnership by incorporating eTC into next generation chipsets and by jointly working with sVR to improve the performance and BOM costs of UNISOC products. The latest high-end product offerings from UNISOC will include Endura’s power technologies, including eVR, sVR, and eTC to provide reductions in bill of material and power usage, while also increasing performance.

“We are very excited to start our operations in China and contribute to the success of much wider effort to increase global competitiveness of the China Semiconductor Industry,” said Taner Dosluoglu, CEO, Endura. “Together with UNISOC, we will introduce best-in-class power management solutions with differentiated power and performance benefits as well as provide area and cost advantages at the same time. This partnership will enhance our ability to disrupt the mobile electronics industry with a paradigm shift in performance versus area and cost.”